Description
Transcend MTE730P M.2 22110 SSD is equipped with Power Loss Protection (PLP) technology, which provides continuous power to the controller and DRAM when the system is not powered, ensuring that data can be stored intact even when the power supply is unstable, achieving highly reliable storage performance.
MTE730P is built with 112-layer 3D NAND flash memory, equipped with an 8-channel controller and PCIe Gen 4 x4 high-speed interface, bringing unprecedented transfer performance. Transcend MTE730P SSD has a built-in DRAM cache that provides excellent random access speeds, while it is equipped with a 30μ” gold-fingered thick gold-plated PCB, corner bond technology, and anti-sulfur resistors to enhance the protection of critical components against harsh industrial applications. MTE730P has undergone rigorous in-house testing and has a wide temperature range (-40°C~85°C), which can operate stably even under sudden temperature changes, demonstrating high reliability.
Product Technology
112-layer 3D flash memory
30μ” PCB Gold Finger
Edge reinforcement
Wide temperature technology
Anti-sulfur technology
spam collection mechanism
Average erasure technique
Fault block management
Power Loss Protection (PLP)
Move early
Firmware features
- Supports NVM commands
- Dynamic thermal energy management mechanism
- Built-in LDPC ECC automatic error correction function
- It supports region-wide average erasure and fault block management to increase reliability
- Supports garbage collection mechanism
- Supports S.M.A.R.T. monitoring function to perform device health monitoring, analysis, and reporting
- TRIM command is supported
- NCQ command is supported
Hardware features
- RoHS 2.0 compliant
- NVM Express 1.4 compliant
- PCI Express 4.0 compliant
- Compliant with the new generation of M.2 specification (Length: 110mm), suitable for thin and light mobile devices
- Equipped with PCIe Gen 4 x4 interface
- Built-in DDR4 DRAM cache
- Uses high-quality 3D NAND flash memory
- Endurance is 3K P/E cycles
- The entire range is equipped with Corner Bond technology to protect critical components
- 30μ” gold finger thick gold plating process
- Anti-sulfur resists the threat of sulfurization in the external environment
- Power Loss Protection (PLP) function to avoid data loss due to accidental power outages
- Supports operation in a wide temperature range (-40°C to 85°C).
Specifications
appearance |
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| Size: | 110 mm x 22 mm x 3.88 mm (4.33″ x 0.87″ x 0.15″) |
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| weight | 11 g (0.39 oz) |
| M.2 specification |
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| Appearance size |
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interface |
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| bus interface |
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storage |
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| capacity |
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| Flash type |
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operating environment |
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| Operating voltage |
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| operating temperature |
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| Storage temperature | -55°C (-67°F) ~ 85°C (185°F) |
| Humidity | 5% ~ 95% |
| Impact resistant |
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| Vibration resistant (in operation) | 20 G (peak-to-peak), 7 Hz ~ 2,000 Hz (frequency) |
Battery |
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| Power Consumption (Operating) | 6.2 watts |
| Power Consumption (IDLE) | 0.8 watts |
Efficiency |
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| Sequential Read and Write Speed (CrystalDiskMark) | Read: Up to 7,500 MB/s Write: Up to 6,700 MB/s |
| 4K Random Read and Write Speed (IOmeter) | Read: Up to 540,000 IOPS Write: Up to 440,000 IOPS |
| Mean Time Between Failures (MTBF) | 3,000,000 hours |
| Megabytes Written (TBW) | Up to 5,920 TBW |
| Daily Full Disk Writes (DWPD) | 1.35 (3 years) |
| Note |
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